White 1.2W/mK Two Compound Thermally Conductive Potting Compound
for Electronic Component
TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal
conductivity, room temperature curable,long working time and firere
sistance.lt is especially suitable for capacitor, small electronic
equipment sealing. Its flexible, elastic characteristics enable it
to provide cushioning for the materials it is coated with. The
lower viscosity aliows the thermal potting adhesive to cover the
surface more fully,greatly increasing the efficiency of heat
transfer from the heating device or the entire PCB to the metal
case or diffusion plate,thus improving the efficiency and service
life of the electronic.
TIS680-12AB-Series-TDS-REV04--High-Thermal-Conduct...
Features
> Good thermal conductive: 1.2W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity, easy gas emissions
> Good solvent resistance and waterproof performance
> longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process
Application
> Industrial control,transformer,coil, amplifier, high voltage
package, relay, high current junction box, etc.;
> Heat sink assembly, thermal sensor potting, thermal conductive
product potting;
> Heat conduction between the battery cell and the cold tube;
> LED and power drive potting;
| Typical Properties of TIS™ 680-12AB Series |
| Material Properties (Before Curing) |
| | TISTM680-12A | TISTM680-12B |
| Color | white | Gray |
| Viscosity @25℃ Brookfield | 3000 mPa.s | 3000 cPs |
| Shelf life @25℃ in sealed container | 6 months | 6 months |
| |
| Mixing ratio (weight ratio) | A:B =100 :100 |
| Mix color | Gray |
Operational Time
(250g @25℃) | 30 mins |
| Conditions for Complete Curing | @25℃ 24H |
| @70℃ 2H |
| @100℃ 1H |
| Material Properties(after Curing) |
| Hardness (Shore A)@25℃ | 65 |
| Density(g/cc) | 1.7 |
| Operating temperature | -40℃ ~160℃ |
| Elongation | 120% |
| Elongation | 4.50% |
| CLTE(1/℃) | 3.0x 10^(-5) |
| Fire resistance UL94 | V-0 |
| Water Absorption Rate (wt%) | < 0.1 |
| Thermal Conductivity | 1.2W/m-K |
| Thermal Impedance @1mm ( ℃- in²/W ) | 0.48 |
| Dielectric Breakdown Voltage ( V/mm) | 6000 |
| Dielectric Constant@1MHz | 4.2 |
| Volume resistivity @ 25℃( ohm-cm) | 3.0x 10^13 |
Packing details:
1KG A/B for each tank.
5KG A/B each.
10KG A/B each.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract.
