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Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

    Buy cheap Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation from wholesalers
     
    Buy cheap Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation from wholesalers
    • Buy cheap Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation from wholesalers
    • Buy cheap Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation from wholesalers

    Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

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    Brand Name : Ziitek
    Model Number : TIE380-45
    Certification : RoHS
    Payment Terms : T/T
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

    4.5W/mK thermal conductivity heat cured epoxy adhesive for bonding two parts of electronics


    Product Summary:

    TIE™380-45 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength.

    TIE™380-45 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

    TIE380-45-TDS_EN_REV01.4 (1).pdf


    Feature


    > Good thermal conductivity: 4.5W/mK

    > Good maneuverability andadhesion performance

    > Low shrinkage

    > Low viscosity, easy-to-gas emissions

    > Good solvent resistance, water resistance

    > Longer working hours

    > Excellent resistance to thermal shock


    Typical Properties of TIETM380-45

    Chemical typeEpoxyTest Method
    Appearance uncuredGray PasteVisual
    Appearance curedDull Gray SolidVisual
    ComponentsOne Component*****
    Heat Capacity0.7 l/g-KASTM C351
    Key SubstratesMetals, ceramics*****
    Hardness92 Shore AASTM 2240
    Continuous Use Temp-40 to 180℃*****
    Tensile strength Al/Al @25°C>2900psi*****
    Thermal Conductivity4.5W/m-KASTM D5470

    Application Features:TIE™380-45

    Color Gray

    Viscosity@25℃ 150,000 cPs

    Specific Gravity@25℃ 2.2 g/cc

    Shelf life @25℃° 10 Days

    @0℃° 6 Months

    (Storage methods and temperature will affect the shelf life)


    Curing procedures:

    Curing temperature Curing time

    100℃° 4 Hours

    125℃ 2 Hour

    150℃ 30 Minutes

    170℃ 5 Minutes


    General package:

    1kg/can

    Company profile


    Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


    FAQ


    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.

    Q: How long is your delivery time?

    A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

    Q: Do you provide samples ? is it free or extra cost?

    A: Yes, we could offer samples free of charge.

    Quality Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation for sale
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