Home > Thermal Epoxy Glue >

High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

Product Categories

Silicone Thermal Pad [139]
Heat Sink Thermal Pad [163]
CPU Thermal Pad [226]
Thermal Graphite Sheet [24]
Thermally Conductive Electrical Insulator [33]
PCM Phase Change Material [23]
Double Sided Thermal Tape [22]
Heat Conductive Plastic [9]
High Temperature Thermal Grease [15]
Thermally Conductive Potting Compound [9]
Thermal Epoxy Glue [9]
Thermal Conductive Silicone Adhesive [4]
Thermal Conductive Gel [23]
Shielding Absorbing Materials [22]
Silicone Foam Sheet [6]
Silicone Free Thermal Pad [12]
Most Popular Products [11]
Film Heating Element [6]

Dongguan Ziitek Electronical Material and Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

Ask Lasest Price
Brand Name :	Ziitek
Model Number :	TIE380-25
Certification :	RoHS
Price :	1-100USD/kg
Payment Terms :	T/T
Supply Ability :	10000kg/month
Delivery Time :	3-8 work days

Add to Cart

Product Details
Company Profile

High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

2022 high thermal conductivity thermal conductive epoxy glue good adhesive for bonding electronics

TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive

Product Summary:

TIE™380-25 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

Feature

Outstanding thermal performance 2.5W/mK

High tack surface reduces contact resistance

RoHS compliant

UL recognized

Fiberglass reinforced for puncture, shear and tear resistance

Easy release construction

Applications

Heat pipe thermal solutions

Memory Modules

Mass storage devices

Automotive electronics

Set top boxes

Audio and video components

IT infrastructure

GPS navigation and other portable devices

Typical Properties of TIE^TM380-25
Chemical type	Epoxy	Test Method
Appearance uncured	Gray Paste	Visual
Appearance cured	Dull Gray Solid	Visual
Components	One Component	*****
Heat Capacity	0.7 l/g-K	ASTM C351
Key Substrates	Metals, ceramics	*****
Hardness	92 Shore A	ASTM 2240
Continuous Use Temp	-40 to 180℃	*****
Tensile strength Al/Al @25°C	>2800psi	*****
Thermal Conductivity	2.5 W/m-K	ASTM D5470

Application Features:TIE™380-25

Color Gray

Viscosity@25℃ 140,000 cPs

Specific Gravity@25℃ 2.1 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃° 3 Hours

125℃ 1.5 Hour

150℃ 20 Minutes

170℃ 5 Minutes

Package:

1kg/can

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product Tags:


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronical Material and Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!