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Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

    Buy cheap Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules from wholesalers
     
    Buy cheap Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules from wholesalers
    • Buy cheap Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules from wholesalers
    • Buy cheap Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules from wholesalers

    Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF1120-30-02US thermal pad
    Certification : UL
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

    Dielectric constant 3.8 MHz Soft and Compressible Thermal Pad for Memory Modules


    Company Profile

    With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


    TIF100-30-02US-Datasheet-REV02.pdf


    Ziitek TIF1120-30-02US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
    <Good thermal conductive:3.0W/mK
    <Thickness:3.0mmT
    <Hardness:20 Shore 00
    <Colour: gray

    <RoHS compliant

    <UL recognized

    <Easy release construction

    Applications

    <mainboard/mother board

    <notebook

    <power supply

    <Heat pipe thermal solutions

    <Memory Modules

    <Mass storage devices


    Typical Properties of TIF1120-30-02US
    Product Name

    TIF1120-30-02US Series

    Colour
    Gray
    Construction & Compostion
    Ceramic filled silicone elastomer

    Specific gravity

    2.9 g/cc

    Thickness

    3.0mmT
    Hardness
    20 Shore 00
    Dielectric constant@1MHz
    3.8 MHz
    Continuos Use Temp
    -40 to 160℃

    Dielectric Breakdown Voltage

    >5500 VAC
    Thermal conductivity
    3.0 W/mK
    Volume Resistivity

    1.0*1012 Ohm-cm


    Standard Sheets Sizes:

    8" x 16"(203mm x 406mm)


    TIF™ series Individual die cut shapes can be supplied.



    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer

    6.Quality assurance contract




    FAQ

    Q: How long is your delivery time?

    A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

    Q: Do you provide samples ? is it free or extra cost?

    A: Yes, we could offer samples free of charge.

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