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3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

    Buy cheap 3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices from wholesalers
     
    Buy cheap 3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices from wholesalers
    • Buy cheap 3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices from wholesalers
    • Buy cheap 3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices from wholesalers

    3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

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    Brand Name : Ziitek
    Model Number : TIF170-30-06UF thermal pad
    Certification : UL
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

    3.0 W/mK Good Performance Heat Sink Pad RoHS Compliant for Mass Storage Devices


    Company Profile

    Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


    TIF100-30-06UF-Series-Datasheet-.pdf
    Ziitek TIF170-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF170-30-06UF is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.


    <Good thermal conductive:3.0 W/mK
    <Thickness: 1.75mmT
    <Hardness:75±5 Shore 00
    <Colour: White

    <Good thermal conductive
    <Moldability for complex parts
    <Soft and compressible for low stress applications


    Applications

    <mainboard/mother board

    <notebook

    <power supply

    <Heat pipe thermal solutions

    <Memory Modules

    <Mass storage devices


    Typical Properties of TIF170-30-06UF
    Product Name

    TIF170-30-06UF Series

    Colour
    White
    Construction & Compostion
    Ceramic filled silicone elastomer

    Specific gravity

    3.0 g/cc

    Thickness

    1.75mmT
    Hardness
    75±5 Shore 00
    Dielectric constant@1MHz
    5.0 MHz
    Continuos Use Temp
    -40 to 160℃

    Dielectric Breakdown Voltage

    >5500 VAC
    Thermal conductivity
    3.0 W/mK
    Volume Resistivity

    2.3*1013 Ohm-cm


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL




    Our services


    Online-service : 12 hours , Inquiry reply within fastest.


    Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

    Well-trained & experienced staff are to answer all your inquiries in English of course.

    Standard Export Carton Or Marked With Customer's Information Or Customized.

    Provide free samples


    After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

    we will help you to deal with it and give you satisfactory solution.




    FAQ

    Q: Do you accept custom orders ?

    A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

    Q: How much are the pads?

    A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

    Quality 3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices for sale
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