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Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

    Buy cheap Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure from wholesalers
     
    Buy cheap Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure from wholesalers
    • Buy cheap Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure from wholesalers
    • Buy cheap Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure from wholesalers

    Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

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    Brand Name : Ziitek
    Model Number : TIF1120-10UF thermal pad
    Certification : UL
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

    -40 to 160℃ Moldability for Complex Parts Conductive Pads for IT Infrastructure


    Company Profile

    Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


    TIF100-10UF-Datasheet-REV02.pdf

    Ziitek TIF1120-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


    <Good thermal conductive:1.5 W/mK
    <Thickness: 3.0mmT
    <Hardness:75 Shore 00
    <Colour: Gray

    <RoHS compliant
    <UL recognized
    <Fiberglass reinforced for puncture, shear and tear resistance


    Applications

    <Automotive electronics

    <Set top boxes

    <Audio and video components

    <IT infrastructure

    <GPS navigation and other portable devices

    <CD-Rom, DVD-Rom cooling


    Typical Properties of TIF1120-10UF
    Product NameTIF1120-10UF Series
    Colourgray
    Construction & CompostionCeramic filled silicone elastomer
    Specific gravity2.2 g/cc
    Thickness3.0mmT
    Hardness75 Shore 00
    Dielectric constant@1MHz3.9 MHz
    Continuos Use Temp-40 to 160℃
    Dielectric Breakdown Voltage>5500 VAC
    Thermal conductivity1.5 W/mK
    Volume Resistivity1.0*1012 Ohm-cm


    Standard Sheets Sizes:

    8" x 16"(203mm x 406mm)


    TIF™ series Individual die cut shapes can be supplied.



    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer

    6.Quality assurance contract




    FAQ

    Q: How do I request customized samples?

    A: To request samples, you can leave us message on website, or just contact us by send email or call us.

    Q: What's the thermal conductivity test method given on the data sheet ?

    A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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