Home > Heat Sink Thermal Pad >

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

Product Categories

Silicone Thermal Pad [144]
Heat Sink Thermal Pad [166]
CPU Thermal Pad [232]
Thermal Graphite Sheet [28]
Thermally Conductive Electrical Insulator [35]
PCM Phase Change Material [27]
Double Sided Thermal Tape [22]
Heat Conductive Plastic [9]
High Temperature Thermal Grease [15]
Thermally Conductive Potting Compound [9]
Thermal Epoxy Glue [9]
Thermal Conductive Silicone Adhesive [4]
Thermal Conductive Gel [23]
Shielding Absorbing Materials [22]
Silicone Foam Sheet [6]
Silicone Free Thermal Pad [12]
Most Popular Products [11]
Film Heating Element [6]

Dongguan Ziitek Electronical Material and Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

Ask Lasest Price
Brand Name :	Ziitek
Model Number :	TIF1120-20-10UF thermal pad
Certification :	ISO9001
Price :	0.1-10 USD/PCS
Payment Terms :	T/T
Supply Ability :	100000pcs/month
Delivery Time :	3-8 work days

Add to Cart

Product Details
Company Profile

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

2.0W/mK Naturally Tacky Needing No Further Adhesive Coating Conductive Pads for CPU

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

TIF100-20-10UF-Datasheet-REV02.pdf

Ziitek TIF1120-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

<Good thermal conductive: 2.0 W/mK

<Thickness: 3.0mmT

<Hardness:75 Shore 00

<Colour: gray

<Moldability for complex parts
<Soft and compressible for low stress applications
<Naturally tacky needing no further adhesive coating

Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

Typical Properties of TIF1120-20-10UF
Product Name	TIF1120-20-10UF Series
Colour	Gray
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	2.7 g/cc
Thickness	3.0mmT
Hardness	75 Shore 00
Dielectric constant@1MHz	4.6 MHz
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	2.0W/mK
Volume Resistivity	1.0*10^{12 _Ohm-cm}

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

FAQ

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Product Tags:


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronical Material and Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!