Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

TIF015AB-07S-Datasheet-REV02.pdf

Ziitek TIF015AB-07S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.

< Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor

Product packing details:

50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing applications. Please contact us for confirming.