4.0W/MK 20 Shore 00 Telecommunication hardware applied 3.0mmT ultra
soft thermal gap pad
TIF5120-40-11US Series thermally conductive interface materials are
applied to fill the air gaps between the heating elements and the
heat dissipation fins or the metal base.Their flexibility and
elasticity make them suited to coat very uneven surfaces. Heat can
transmit to the metal housing or dissipation plate from the heating
elements or even the entire PCB, which effecitly enhances the
efficiency and life-time of the heatgenerating electronic
components.
TIF500-40-11US
Datasheet-REV02.pdf
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D,
manufacture and sales of the thermal interface materials (TIMs). We
have rich experiences in this field which can support you the
latest, most effective and one -step thermal management solutions.
We have many advanced production equipments,full test equipments
and fully automatic coating production lines which can support the
production for high performance thermal silicone pad, thermal graphite sheet/
film, thermal double-sided tape, thermal insulation pad, thermal
ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Features
<Thickness:3.0mmT
<Good thermal conductive:4.0W/MK
<Moldability for complex parts
<Soft and compressible for low stress applications
<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available
<Moldability for complex parts
<Outstanding thermal performance
<High tack surface reduces contact resistance
<RoHS compliant
Applications
<Telecommunication hardware
<Handheld portable electronics
<Heat pipe thermal solutions
<Memory Modules
<Monitoring the Power Box
<AD-DC Power Adapters
<Rainproof LED Power
<Waterproof LED Power
Typical Properties of TIF 5120-40-11US |
Product Name | TIF5120-40-11US Series |
Colour | Grey |
Construction & Compostion | Ceramic filled silicone rubber |
Specific Gravity | 3.1 g/cc |
Dielectric Constant@1MHz | 4.0 MHz |
Hardness | 20 Shore 00 |
Outgassing (TML) | 0.35% |
Continuos Use Temp | -40 to 160℃ |
Dielectric Breakdown Voltage | >5500 VAC |
Thermal conductivity | 4.0W/mK |
Thickness | 3.0mmT |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Advantage
Ziitek has independent R&D team. This team is experience,
rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek
thermal conductive materials. With well-equipped testing equipment,
we Ziitek can also do some tests with customers' samples, so we can
find a more suitable Ziitek materials for every customer.
