Ziitek TIF5120-50-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

TIF500-50-11US Datasheet-REV02.pdf

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

<Good thermal conductive:5.0W/m-k

<Thickness:3.0mmT

<UL recognized

<Outstanding thermal performance

<Soft and compressible for low stress applications

<Automotive electronics

<power supply

<Heat pipe thermal solutions

<Memory Modules

<LED Ceilinglamp

<Monitoring the Power Box

<AD-DC Power Adapters

<RDRAM memory modules