3.0 g/cc , 4.0 MHz Electrically isolating silicone thermal pad for
Heat Sinking Housing at LED-lit BLU in LCD
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D,
manufacture and sales of the thermal interface materials (TIMs). We
have rich experiences in this field which can support you the
latest, most effective and one -step thermal management solutions.
We have many advanced production equipments,full test equipments
and fully automatic coating production lines which can support the
production for high performance thermal silicone pad, thermal graphite sheet/
film, thermal double-sided tape, thermal insulation pad, thermal
ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
TIF100-30-11US-Series-Datasheet-.pdf
TIF1160-30-11US is a highly compliant Gap Pad material that is ideal for fragile
component leads. The material is fiberglass reinforced for improved
puncture resistance and handling TIF1160-30-11US maintains a conformable, yet elastic nature that provides excellent
interfacing and wet-out characteristics, even to surfaces with high
roughness or uneven topography.TIF1160-30-11US features an inherent tack on both sides of the material,
eliminating the need for thermally impeding adhesive layers.Options
and ConfigurationsStandard sheet size - 8" x 16" or custom
configurationStandard thickness available - 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made
configurations available upon request
Features
<Good thermal conductive:3.0W/mK
<Thickness:4.0mmT
<Hardness:20±5 Shore 00
<Colour: gray
<Soft and compressible for low stress applications
<RoHS compliant
<UL recognized
Applications
<Handheld portable electronics
<Semiconductor automated test equipment (ATE)
<CPU
<display card
<mainboard/mother board
<notebook
Typical Properties of TIF1160-30-11US |
Product Name | TIF1160-30-11US Series |
Colour | gray |
Construction & Compostion | Ceramic filled silicone elastomer |
Specific gravity | 3.0 g/cc |
Thickness | 4.0mmT |
Hardness | 20±5Shore 00 |
Dielectric constant@1MHz | 4.0 MHz |
Continuos Use Temp | -40to 160℃ |
Dielectric Breakdown Voltage | >5500 VAC |
Thermal conductivity | 3.0W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
