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20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware

    Buy cheap 20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware from wholesalers
     
    Buy cheap 20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware from wholesalers
    • Buy cheap 20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware from wholesalers
    • Buy cheap 20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware from wholesalers

    20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware

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    Brand Name : Ziitek
    Model Number : TIF1100-30-11US thermal pad
    Certification : UL
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware

    20±5 Shore 00 high cost-effective thermal conductive gap filler for Telecommunication hardware


    Company Profile

    With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


    TIF100-30-11US-Series-Datasheet-.pdf

    TIF1100-30-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
    Features
    <Good thermal conductive:3.0W/mK
    <Thickness:2.5mmT
    <Hardness:20±5 Shore 00
    <Colour: gray

    <Fiberglass reinforced for puncture, shear and tear resistance

    <Easy release construction

    <Electrically isolating

    Applications

    <Telecommunication hardware

    <Handheld portable electronics

    <Semiconductor automated test equipment (ATE)

    <CPU

    <Audio and video components

    <IT infrastructure

    <GPS navigation and other portable devices

    <CD-Rom, DVD-Rom cooling


    Typical Properties of TIF1100-30-11US
    Product Name

    TIF1100-30-11US Series

    Colour
    gray
    Construction & Compostion
    Ceramic filled silicone elastomer

    Specific gravity

    3.0 g/cc

    Thickness

    2.5mmT
    Hardness
    20±5Shore 00
    Dielectric constant@1MHz
    4.0 MHz
    Continuos Use Temp
    -40to 160℃
    Dielectric Breakdown Voltage
    >5500 VAC
    Thermal conductivity
    3.0W/mK
    Volume Resistiviyt

    1.0*1012 Ohm-cm

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated

    Advantage


    Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

    They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

    Quality 20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware for sale
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