Factory supply low cost thermal conductive gap filler,2.0mmT
1.8W/mK for micro heat pipe thermal solutions
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to
developing composite thermal solution and manufacturing superior
thermal interface materials for competitive market.
Our vast experience allows us to assist our customers best in
thermal engineering field.
We serve customers with customized products, full product lines and
flexible production, which makes us be the best and reliable
partner of you. Let's make your design more perfect!
TIF100-18-01US-Specification-sheet.pdf
TIF180-18-01US is a highly compliant Gap Pad material that is ideal for fragile
component leads. The material is fiberglass reinforced for improved
puncture resistance and handling TIF180-18-01US maintains a conformable, yet elastic nature that provides excellent
interfacing and wet-out characteristics, even to surfaces with high
roughness or uneven topography. TIF180-18-01US features an inherent tack on both sides of the material,
eliminating the need for thermally impeding adhesive layers.Options
and ConfigurationsStandard sheet size - 8" x 16" or custom
configurationStandard thickness available - 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made
configurations available upon request
Features
<Good thermal conductive:1.8W/mK
<Thickness:2.0mmT
<Hardness:18 Shore 00
<Colour: black
<Easy release construction
<High tack surface reduces contact resistance
<Outstanding thermal performance
Applications
<Mass storage devices
<Automotive electronics
<Set top boxes
<Audio and video components
<IT infrastructure
<Micro heat pipe thermal solutions
<Automotive engine control units
<Telecommunication hardware
Typical Properties of TIF180-18-01US |
Product Name | TIF180-18-01US Series |
Colour | black |
Construction & Compostion | Ceramic filled silicone elastomer |
Specific gravity | 2.5 g/cc |
Thickness | 2.0mmT |
Hardness | 18 Shore 00 |
Dielectric constant@1MHz | 4.5 MHz |
Continuos Use Temp | -40to 160℃ |
Dielectric Breakdown Voltage | >5500 VAC |
Thermal conductivity | 1.8 W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat
dissipation. Please tell us your detailed applications and the
power, so we can recommend most suitable thermal conductive
materials.
