China company supplied Easy release construction thermal conductive
gap pad for Memory Modules ,18 shore00,3.0W/mK
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
TIF100-30-06US.pdf
TIF120-30-06US is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
Features
<Good thermal conductive:3.0W/mK
<Thickness:0.5mmT
<Hardness:18 Shore 00
<Colour: white
<Good thermal conductive
<Moldability for complex parts
<Soft and compressible for low stress applications
Applications
<notebook
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
<Automotive electronics
Typical Properties of TIF120-30-06US |
Product Name | TIF120-30-06US Series |
Colour | white |
Construction & Compostion | Ceramic filled silicone elastomer |
Specific gravity | 3.0 g/cc |
Thickness | 0.5mmT |
Hardness | 18 Shore 00 |
Dielectric constant@1MHz | 4.0 MHz |
Continuos Use Temp | -40to 160℃ |
Dielectric Breakdown Voltage | >5500 VAC |
Thermal conductivity | 3.0 W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
FAQ
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat
dissipation. Please tell us your detailed applications and the
power, so we can recommend most suitable thermal conductive
materials.
