Home > CPU Thermal Pad >

Mother Board Applicated Soft Thermal Conductive Gap Pad 5.0W/M-K 45shore00

Product Categories

Silicone Thermal Pad [139]
Heat Sink Thermal Pad [163]
CPU Thermal Pad [226]
Thermal Graphite Sheet [24]
Thermally Conductive Electrical Insulator [33]
PCM Phase Change Material [23]
Double Sided Thermal Tape [22]
Heat Conductive Plastic [9]
High Temperature Thermal Grease [15]
Thermally Conductive Potting Compound [9]
Thermal Epoxy Glue [9]
Thermal Conductive Silicone Adhesive [4]
Thermal Conductive Gel [23]
Shielding Absorbing Materials [22]
Silicone Foam Sheet [6]
Silicone Free Thermal Pad [12]
Most Popular Products [11]
Film Heating Element [6]

Dongguan Ziitek Electronical Material and Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Mother Board Applicated Soft Thermal Conductive Gap Pad 5.0W/M-K 45shore00

Ask Lasest Price
Brand Name :	Ziitek
Model Number :	TIF5200-50-11S thermal pad
Certification :	UL
Price :	0.1-10 USD/PCS
Payment Terms :	T/T
Supply Ability :	100000pcs/month
Delivery Time :	3-8 work days

Add to Cart

Product Details
Company Profile

Mother Board Applicated Soft Thermal Conductive Gap Pad 5.0W/M-K 45shore00

5.0mm mainboard/mother board Applicated Soft thermal conductive gap pad 5.0W/M-K 45shore00

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

TIF500-50-11S Datasheet-REV02.pdf

TIF5200-50-11S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heatgenerating electronic components.

Features

Broad range of hardnesses available 5.0 W/mK

Electrically isolating

Outstanding thermal performance

Thickness:5.0mmT

Good thermal conductive

Easy release construction

Moldability for complex parts

Applications

Mass storage devices

mainboard/mother board

Broad range of hardnesses available

Semiconductor automated test equipment (ATE)

Audio and video components

Handheld portable electronics

GPS navigation and other portable devices

CD-Rom, DVD-Rom cooling

Telecommunication hardware

LED Power Supply

IT infrastructure

Typical Properties of TIF5200-50-11S
Product Name	TIF5200-50-11S Series
Colour	Grey
Construction & Compostion	Ceramic filled silicone rubber
Specific Gravity	3.15 g/cc
Dielectric Constant@1MHz	4.0 MHz
Hardness	45Shore 00
Flame Rating	94 -V0
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	5.0W/mK
Thickness	5.0mm

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Packaging Details & Lead time

The packaging of thermal pad

1. with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Product Tags:


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronical Material and Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!