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Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating

Dongguan Ziitek Electronical Material and Technology Ltd.
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    Buy cheap Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating from wholesalers
     
    Buy cheap Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating from wholesalers
    • Buy cheap Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating from wholesalers
    • Buy cheap Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating from wholesalers

    Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF160-02F Series
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating

    Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating​


    Company Profile


    Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


    The TIF160-02F Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


    Features


    > Good thermal conductive
    > Moldability for complex parts
    > Soft and compressible for low stress applications
    > Naturally tacky needing no further adhesive coating
    > Available in varies thicknesses
    > Broad range of hardnesses available
    > Moldability for complex parts
    > Outstanding thermal performance


    Applications


    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Display card

    Typical Properties of TIF160-02F Series
    Color
    Gray white
    Visual
    Construction & Compostion
    Ceramic filled silicone elastomer
    ******
    Specific Gravity
    2.3 g/cc
    ASTM D297
    Thickness range0.020"-0.200"
    ASTM C351
    Hardness
    60 Shore 00
    ASTM 2240
    Dielectric Breakdown Voltage
    >5500 VAC
    ASTM D412
    Continuos Use Temp
    -45 to 200℃
    ******
    Outgassing(TML)
    0.35%
    ASTM E595
    Dielectric Constant
    4.0 MHz
    ASTM D150
    Volume Resistivity
    1.0X10¹² Ohm-meter
    ASTM D257
    Fire rating
    94 V0
    equivalent UL
    Thermal conductivity
    1.5W/m-K
    ASTM D5470

    Standard Thicknesses:

    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Standard Sheets Sizes:
    8" x 16"(203mm x 406mm)
    TIF™ series Individual die cut shapes can be supplied.


    Peressure Sensitive Adhesive:
    Request adhesive on one side with "A1" suffix.
    Request adhesive on double side with "A2" suffix.


    Reinforcement:
    TIF™ series sheets type can add with fiberglass reinforced.

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    Quality Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating for sale
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