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1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

    Buy cheap 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application from wholesalers
     
    Buy cheap 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application from wholesalers
    • Buy cheap 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application from wholesalers
    • Buy cheap 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application from wholesalers

    1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF100-10-01U Series
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

    1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application


    Company Profile


    Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


    The TIF100-10-01U Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


    TIF100-10-01U-TDS_EN_REV02-.pdf


    Features
    > Good thermal conductive: 1.0W/mK
    > RoHS compliant
    > UL recognized
    > Tear resistance
    > Easy release construction
    > Electrically isolating
    > High durability



    Applications
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Display card
    > Mainboard/mother board


    Typical Properties of TIF100-10-01U Series
    ColorDark grayVisual
    Construction &CompostionCeramic filled silicone elastomer***
    Specific Gravity2.1g/ccASTM D297
    Thickness range0.020"(0.5mm)~0.200"(5.0mm)ASTM C351
    Hardness27 Shore 00ASTM 2240
    Dielectric Breakdown Voltage>5000 VACASTM D412
    Continuos Use Temp-40 to 160℃***
    Outgassing(TML)0.35%ASTM E595
    Dielectric Constant4.5 MHzASTM D150
    Volume Resistivity1.0X10¹² Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity1.0W/m-KASTM D5470
    Standard Sheets Sizes:


    8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
    TIF™ series Individual die cut shapes can be supplied.


    Peressure Sensitive Adhesive:

    Request adhesive on one side with "A1" suffix.

    Request adhesive on double side with "A2" suffix.


    Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

    1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application


    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    FAQ

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: How long is your delivery time?

    A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


    Q: Do you provide samples ? is it free or extra cost?

    A: Yes, we could offer samples free of charge.

    Quality 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application for sale
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