High Thermal Conductive Liquid Metal Thermal Paste For CPU GPU
Cooling PC AMD Intel Processor
TS-Ziitek-Sharp Metal LO1 liquid metal at room temperature is in a liquid state and has low
surface tension.Ordinary metals become liquid after being heated to
their melting point.
The new material technology and alloying process allow the metals
with very high melting orboiling points at room temperature to be
in a liquid state, characterized by high fluidity andthermal
conductivity.
Liquid metals do not evaporate easily, do not corrode, are safe and
non-toxic, and have stablephysical properties. They are a highly
safe fluid material that can ensure the high efficiency, long-term,
and stable operation of heat dissipation systems.Liquid metal heat
dissipation technology can provide a comprehensive and efficient
solution for large-scale heat dissipation needs.
The liquid metal involved is the core technology of the heat
dissipation domain, and with the increase in chip integration in
the future, the role of liquid metal in heat dissipation devices
will become even greater.
Features
> Good thermal conductivity
> Non-toxic and environmentally safe
> Excellent long term stability
> Ensure low thermal resistance.
Applications
> Microprocessors
> Chipsets
> Graphic processing chips
> Set Top Box
> LED light
| Typical Properties of Ziitek-Sharp Metal L01 Series |
| Property | Value | Test Method |
| Type | Liquid | ***** |
| Composition | Gallium Alloy | ***** |
| Density (g/cm³) | 6.5 | ASTM D792 @25℃ |
| 6.4 | ASTM D792 @80℃ |
| Thermal conductivity(W/mK) | 26.5 | ISO22007-2.2 @25℃ |
| 30.0 | ISO22007-2.2 @80℃ |
| Specific heat capacity(J/g℃) | 0.39 | ASTM E1269@25℃ |
| 0.38 | ASTM E1269@80℃ |
| Volatiliy(%) | ＜0.001 | ASTM E595 |
| Resistivity (Ω-m) | ＜10-7 | ASTM D257 |
| Viscosity(mP·S) | ＜10 | GB/T 10247 |
| Melting Range(℃) | >9 | ASTM D3418 |
| Solidification Range(℃) | ＜-28 | ASTM D3418 |
| Continuous Use Temp(℃) | -45 to 250 | Ziitek Test Method |
Packaing:
TS-Ziitek-Sharp Metal L01 is available in 1ml syringes.
Storage Method:
Store at 20-30°C in a dry environment with humidity ≤70%.
Avoid freezing (<5℃) and do not use aluminum or metal
containers.
Usage lnstructions:
Avoid direct contact with aluminum to prevent corrosion. After
applying L01, use a compatible thermal pad or foam to enclose and
secure the area along the edges of the liquid metal, ensuring it
remains contained without leaking or spreading.
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
