10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

TIF^®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.

Features:
> Excellent thermal conductivity10.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU And GPU processors and other chipsets
> Display card
> Mainboard/mother board
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

Dongguan Ziitek Electronical Material and Technology Ltd.  provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Ziitek D-U-N-S® Number: 656191068