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High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

    Buy cheap High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad from wholesalers
     
    Buy cheap High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad from wholesalers
    • Buy cheap High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad from wholesalers
    • Buy cheap High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad from wholesalers

    High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF100 6520-11
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

    High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad


    Company Profile


    ZiitekZiitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling efficient heat tansfer from discrete components or the entire PCB to the metal housing or heat sink ,This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.


    Features:
    > Excellent thermal conductivity 6.5W/mK

    > Moldability for complex parts
    > Soft and compressible for low stress applications
    > Easy release construction
    > Electrically isolating
    > High durability


    Applications:
    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > CPU And GPU processors and other chipsets
    > Display card
    > Mainboard/mother board
    > Memory Modules
    > Audio and video components
    > LED floor light
    > Routers
    > Medical Devices
    > Auditioning electronic products
    > unmanned aerial vehicle(UAV)

    Typical Properties of TIF®100 6520-11 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.3g/ccASTM D297
    thickness0.020"(0.50mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)20 (Shore 00)ASTM 2240
    Continuos Use Temp-45 to 200℃******
    Dielectric Breakdown Voltage≥5000 VACASTM D149
    Dielectric Constant6.5MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity6.5W/m-KASTM D5470

    Product Specification
    Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
    Product Sizes:16" x 16"(406mm x406mm)
    Component Codes:
    Reinforcement Fabric: FG (Fiberglass).
    Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
    Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
    Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
    The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)


    Consult the factory to alternate thickness.

    High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated.


    FAQ:

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: What kind of packaging you offer?

    A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.


    Q:Do big buyers have promotional prices?

    A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

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