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3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized

    Buy cheap 3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized from wholesalers
     
    Buy cheap 3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized from wholesalers
    • Buy cheap 3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized from wholesalers
    • Buy cheap 3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized from wholesalers

    3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF300 Series
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized

    3.0W High Quality Factory Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

    Company Profile


    Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    TIFTM300 Series thermally conductive interface materials are applied to fill theair gaps between the heating elements and the heat dissipation fins or the metalbase.Their flexibility and elasticity make them suited to coat very unevensurfaces.Heat can transmit to the metal housing or dissipation plate from theheating elements or even the entire PCB, which effecitly enhances the efficiencyand life-time of the heat-generating electronic components.


    Features:
    > Excellent thermal conductivity 3.0W/mK

    > Moldability for complex parts
    > Soft and compressible for low stress applications
    > Naturally tacky needing no further adhesive coating
    > Available in varies thicknesses
    > Broad range of hardnesses available


    Applications:
    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Display card

    Typical Properties of TIFTM300 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.05g/ccASTM D297
    thickness0.020"(0.50mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)27±5 (Shore 00)ASTM 2240
    Continuos Use Temp-45 to 200℃******
    Dielectric Breakdown Voltage≥5500 VACASTM D149
    Dielectric Constant4.5MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity3.0W/m-KASTM D5470

    Product Specification
    Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
    Product Sizes:8" x 16"(203mm x406mm)
    Additional model code instructions:
    FG: Fiberglass reinforcement
    A1/A2: Singleldouble sided with Adhesive

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)


    Consult the factory to alternate thickness.

    3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated.


    FAQ:

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: How long is your delivery time?

    A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


    Q: Do you offer free samples ?

    A: Yes, we are willing to offer free sample.

    Quality 3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized for sale
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