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10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads

    Buy cheap 10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads from wholesalers
     
    Buy cheap 10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads from wholesalers
    • Buy cheap 10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads from wholesalers
    • Buy cheap 10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads from wholesalers

    10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF100 10055-62
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads

    Thermal Pad 0.5mm CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads For Graphics Card


    Company Profile


    Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    TIF®100 10055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.


    Features:
    > Excellent thermal conductivity 10.0W/mK

    > Naturally tacky needing no further adhesive coating
    > High compliance adapts to various pressure application environments
    > Available in varies thicknesses
    > Broad range of hardnesses available
    > Moldability for complex parts


    Applications:
    > Heat dissipation structure for radiators

    > Telecommunication equipment
    > Automotive electronics
    > Battery packs for electric vehicles

    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Display card
    > Mainboard/mother board
    > Notebook

    Typical Properties of TIF®100 10055-62 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.4g/ccASTM D792
    thickness0.020"(0.5mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)55 (Shore 00)ASTM 2240
    Continuos Use Temp-40 to 200℃******
    Dielectric Breakdown Voltage≥5000 VACASTM D149
    Dielectric Constant7.0MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0

    UL94(E331100)

    Thermal conductivity10.0W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)


    Consult the factory to alternate thickness.


    Product Specification
    Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm)
    Product Sizes:16" x 16"(406mm x406mm)
    Component Codes:
    Reinforcement Fabric: FG (Fiberglass).
    Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
    Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
    Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
    The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
    10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated.


    FAQ:

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: How to find a right thermal conductivity for my applications

    A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.


    Q: Do you accept custom orders ?

    A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

    Quality 10.0W/mK Thermal Pad for CPU GPU Cooling SSD Thermal Paste Thermal Grease Thermal Pads for sale
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