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6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS

Dongguan Ziitek Electronical Material and Technology Ltd.
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    Buy cheap 6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS from wholesalers
     
    Buy cheap 6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS from wholesalers
    • Buy cheap 6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS from wholesalers
    • Buy cheap 6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS from wholesalers

    6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TS-TIF100C 6530-11
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS

    6.5W High Quality Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS


    Company Profile


    Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    The TS-TIF ®100C 6530-11 Series is a silicone-based thermal material designed to fill the gapsbetween heat-generating components and liquid cooling plates or metal bases. lts flexibility andelasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, itefficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metalheat dissipation structures, thereby improving the cooling efficiency of high-power electroniccomponents and extending the lifespan of the equipment.


    Features:
    > Excellent thermal conductivity 6.5W/mK

    > Moldability for complex parts
    > Soft and compressible for low stress applications
    > Naturally tacky needing no further adhesive coating

    > Outstanding thermal performance
    > High tack surface reduces contact resistance
    > RoHS compliant


    Applications:
    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Power supply
    > Heat pipe thermal solutions
    > Memory Modules
    > Mass storage devices
    > Automotive electronics

    Typical Properties of TS-TIF ®100C 6530-11 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.4g/ccASTM D792
    thickness0.012"(0.30mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)30 (Shore 00)ASTM 2240
    Continuos Use Temp-40 to 200℃******
    Dielectric Breakdown Voltage≥5500 VACASTM D149
    Dielectric Constant7.0MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0

    UL94(E331100)

    Thermal conductivity6.5W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)


    Consult the factory to alternate thickness.


    Product Specification:
    Product Thicknesses: 0.012"(0.30mm)~0.200"(5.00mm)
    Product Sizes: 8" x 16"(203mm x406mm)
    Custom die-cut shapes and thicknesses are available.Please contact us for details.
    Store in a cool, dry place, away from fire and sunlight.For more information, refer to the Material Safety Data Sheet .
    6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated.


    FAQ:

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: Do you accept custom orders ?

    A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .


    Q:How can we get detailed price list?

    A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

    Quality 6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS for sale
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