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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

    Buy cheap Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad from wholesalers
     
    Buy cheap Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad from wholesalers
    • Buy cheap Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad from wholesalers
    • Buy cheap Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad from wholesalers

    Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

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    Brand Name : Ziitek
    Model Number : TIF7100PUS thermal pad
    Certification : UL
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

    Wholesale Customized High Temperature Thermal Conductive Silicone Insulation Pad For Display card GPU Laptop


    Company Profile


    Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


    TIF700PUS-data sheet.pdf

    Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad



    Ziitek TIF7100PUS is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling


    < Good thermal conductive: 7.5W/mK
    < Thickness: 2.5mmT
    < Hardness: 20
    < Colour: gray

    < Good thermal conductive
    < Moldability for complex parts
    < Soft and compressible for low stress applications


    Applications

    > Heat pipe thermal solutions
    > Memory Modules
    > Mass storage devices
    > Automotive electronics
    > Set top boxes
    > Audio and video components


    Typical Properties of TIF7100PUS
    Product NameTIF7100PUS Series
    ColourGray
    Construction & CompostionCeramic filled silicone elastomer
    Specific gravity

    3.2 g/cc

    Thickness2.5mmT
    Hardness(Shore 00)20
    Dielectric constant@1MHz4.5 MHz
    Continuos Use Temp-40 to 160℃
    Dielectric Breakdown Voltage>6000 VAC
    Thermal conductivity7.5W/mK
    Flame Rating94-V0

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer

    6.Quality assurance contract


    FAQ


    Q: What's the thermal conductivity test method given on the data sheet ?

    A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


    Q: How to find a right thermal conductivity for my applications

    A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.


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