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High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

    Buy cheap High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive from wholesalers
     
    Buy cheap High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive from wholesalers
    • Buy cheap High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive from wholesalers
    • Buy cheap High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive from wholesalers

    High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

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    Brand Name : Ziitek
    Model Number : TIE280-12AB
    Certification : RoHS
    Price : 1-100USD/kg
    Payment Terms : T/T
    Supply Ability : 10000kg/month
    Delivery Time : 3-8 work days
    • Product Details
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    High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

    Thermal Conductive Glue Electronic Epoxy Resin Adhesive


    TIE™280--12AB is a two-component, high thermal conductivity, room-temperature curing, long working time and fireproof epoxy resin potting compound, which is especially suitable for potting capacitors and small electronic devices.


    Product Summary:


    TIE™280-12AB is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


    TIE280-12AB-Series-Datasheet.pdf


    Feature


    Outstanding thermal performance 1.2W/mK
    High tack surface reduces contact resistance
    RoHS compliant
    UL recognized
    Fiberglass reinforced for puncture, shear and tear resistance
    Easy release construction

    Applications


    Heat pipe thermal solutions
    Memory Modules
    Mass storage devices
    Automotive electronics
    Set top boxes
    Audio and video components
    IT infrastructure
    GPS navigation and other portable devices

    Typical Properties of TIETM280-12A

    Chemical typeEpoxyTest Method
    Appearance uncuredBlack PasteVisual
    Appearance curedDull Black SolidVisual
    ComponentsTwo Component*****
    Heat Capacity0.7 l/g-KASTM C351
    Key SubstratesMetals, ceramics*****
    Hardness85 Shore DASTM 2240
    Continuous Use Temp-40 to 160℃*****
    Tensile strength Al/Al @25°C>10,000psi*****
    Thermal Conductivity1.2 W/m-KASTM D5470

    Application Features:

    TIE™380-12A

    Color Black

    Viscosity@25℃ 15,000 cPs

    Shelf life @25℃° 12Months


    TIE™380-12B

    Color Black

    Viscosity@25℃ 7,000 cPs

    Shelf life @25℃° 12Months


    TIE™380-12AB(Two Component Mix)

    Viscosity(@25℃ )1,000 cPs

    Operating time9(@ 25℃)45Minutes

    Specific Gravity (@25℃) 1.6 g/cc


    Shelf life( @25℃°) 12Months


    Curing procedures:

    Curing temperature Curing time

    25℃° 3 Hours

    70℃ 30Minutes


    Package:


    1KG A/B for each tank. 5KG A/B each. 10KG A/B each.



    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    Quality High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive for sale
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