Phase Change Material CPU Cooling
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
The TIC80OK Series products is a high thermal conduction and
dielectric performance insulator pad consisting of a ceramic filled
low melting point compound coated on MT Kapton film.
At 50℃,TIC800K Series surface begins to soften and flow, filling
the microscopic irregularities of both the thermal solution and the
integrated circuit package surface, thereby reducing thermal
resistance.
TIC800K-Serice-Datasheet(E)-REV01.pdf
Features
> Highly compliant surfacecharacteristic with highthermal
conductivity.
> High thermal conductive andHigh dielectric strength.
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures.
Applications
> Power conversion equipment
> Power semiconductors:
> T0 packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface
| Typical Properties of TIC™800K series |
| Product Name | TIC™805K | TIC™806K | TIC™808K | Test Method |
| Color | Light Amber | Visual |
| Composite Thickness | 0.004"/0.102mm | 0.005"/0.127mm | 0.006"/0.152mm | ASTM D374 |
| MT Kapton ® Thickness | 0.001"/0.025mm | 0.001"/0.025mm | 0.002"/0.050mm | ASTM D374 |
| Total Thickness | 0.005"/0.127mm | 0.006"/0.152mm | 0.008"/0.203mm | ASTM D374 |
| Specific Gravity | 2.0 g/cc | ASTM D297 |
| Heat Capacity | 1 l/g-K | ASTM C351 |
| Tensile Strength | >13.5 Kpsi | >13.5 Kpsi | >17.8 Kpsi | ASTM D412 |
| Continuous Use Temp | (-58 to 266℉) / (-50 to 130℃) | *** |
| Dielectric Breakdown Voltage | >4000 VAC | >5000 VAC | >6000 VAC | ASTM D149 |
| Dielectric Constant | 1.8 MHz | ASTM D150 |
| Volume Resistivity | 3.5X1014Ohm-meter | ASTM D257 |
| Flame Rating | 94 V0 | equivalent UL |
| Thermal conductivity | 1.3 W/mK |
| Thermal Impedance@50psi | 0.12℃-in²/W | 0.16℃-in²/W | 0.21℃-in²/W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) ,0.006"(0.152mm), 0.008"(0.203mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming.
Standard Sizes :
10" x 100(254mm x 30.48M) Individual die cut shapes can be
supplied.
Peressure Sensitive Adhesive :
Peressure Sensitive Adhesive is not applicable for TICTM800K series
products.
Reinforcement:
TICTM800K series sheets are Kapton reinforced.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just
contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
