Low Thermal Resistance Phase Change pad For Electronic Components
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
TIC™800P Series is low melting point thermal interface material.At 50℃, TIC™800P series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.
TIC™800P series is a flexible solid at room temperature and freestanding
without reinforcing components that reduce thermal performance.
TIC™800P Series shows no thermal performance degradation after 1,000
hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material
softens and does not fully change state resulting in minimal
migration (pump out)at operating temperatures.
TIC800P-Series-Datasheet.pdf
Features
> Highly compliant surfacecharacteristic with highthermal
conductivity.
> High thermal conductive andHigh dielectric strength.
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures.
Applications
> Power conversion equipment
> Power semiconductors:
> T0 packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface
| Typical Properties of TIC™800P series |
| Product Name | TIC™805P | TIC™808P | TIC™810P | Test Method |
| Color | Pink | Visual |
| Thickness | 0.005"/0.126mm | 0.008"/0.203mm | 0.010"/0.254mm | ***** |
| Thickness Tolerrance | ±0.0008"/0.019mm | ±0.0008"/0.019mm | ±0.0012"/0.030mm | ***** |
| Specific Gravity | 2.2 g/cc | Helium Pycnometer |
| Phase change softening Temperature | 50℃-60℃ | ****** |
| Temperature Range | -25to 125℃ | ****** |
| Thermal conductivity | 0.95W/mK | ASTM D5470 |
| Thermal Impedance@50psi | 0.24℃-in²/W | 0.053℃-in²/W | 0.080℃-in²/W | ASTM D5470 |
| 0.15℃-cm²/W | 0.34℃-cm²/W | 0.52℃-cm²/W |
Standard Thicknesses:
0.005"(0.127mm),0.008"(0.203mm),0.010"(O.254mm)
Consult the factory alternate thickness.
Standard Sizes:
10"x 16"(254mm x 406mm)16" X 400’(406mm x 121.92M)
TIC™800P series are supplied with a white release paper and a bottom liner.
TIC™800P series is available inkiss cut an extended pull tab liner or
individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800P series products.
Reinforcement:
No reinforcement is necessary.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just
contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
