Low Thermal Resistance Phase Change pad For Electronic Components
Ziitek company is a manufacturer of thermal conductive gap fillers,
low melting point thermal interface materials, thermal conductive
insulators, thermally conductive tapes, electrically & thermally
conductive Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
TIC™800A-AL series is low melting point thermal interface material.At 50℃, TIC™800A-AL series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.
TIC™800A-AL series is a flexible solid at room temperature and freestanding
without reinforcing components that reduce thermal performance.
TIC™800A-AL Series shows no thermal performance degradation after 1,000
hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material
softens and does not fully change state resulting in minimal
migration (pump out)at operating temperatures.
TIIC800A-AL-data
sheet.pdf
Features
> 0.021℃-in²/W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications
> Power conversion equipment
> Power semiconductors:
> T0 packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface
| Typical Properties of TICTM800A-AL Series |
| Product Name | TICTM805A-AL | TICTM808A-AL | TICTM810A-AL | TICTM820A-AL | Test Method |
| Color | Gray / Silve | Gray / Silver | Gray / Silver | Gray / Silver | Visual |
| Thickness | 0.005" | 0.008" | 0.010" | 0.020" | ***** |
| (0.126mm) | (0.203mm) | (0.254mm) | (0.508mm) |
| Thickness Tolerance | ±0.0008'' | ±0.0008'' | ±0.0012'' | ±0.0020'' | ***** |
| (±0.019mm) | (±0.019mm) | (±0.030mm) | (±0.050mm) |
| Density | 2.5g/cc | Helium Pycnometer |
| Temperature range | -25℃～125℃ | ***** |
| Phase Change Softening Temperature | 50℃~60℃ | ***** |
| Thermal Conductivity | 2.5 W/mK | ASTM D5470 (modified) |
| Thermal Impedance @ 50 psi(345 KPa) | 0.063℃-in²/W | 0.08℃-in²/W | 0.097℃-in²/W | 0.157℃-in²/W | ASTM D5470 (modified) |
| 0.40℃-cm²/W | 0.52℃-cm²/W | 0.63℃-cm²/W | 1.13℃-cm²/W |
Standard Thicknesses:
0.005"(0.127mm), 0.008"(0.203mm), 0.010"(0.254mm, 0.020"(0.508mm)
Consult the factory alternate thickness.
Standard Sizes:
10"x 16"(254mm x 406mm)
TIC800A-AL series are supplied with a white release paper and a bottom liner.
TIC800A-AL series is available in kiss cut an extended pull tab liner or
individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC800A-AL series products.
Reinforcement:
No reinforcement is necessary.
Independent R&D team
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FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful
for several months, we can apply other payment term for you, pay
together in every month or 30 days.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
