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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

    Buy cheap High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound from wholesalers
     
    Buy cheap High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound from wholesalers
    • Buy cheap High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound from wholesalers
    • Buy cheap High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound from wholesalers

    High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIE™380-25
    Certification : RoHS
    Price : 1-100USD/kg
    Payment Terms : T/T
    Supply Ability : 10000kg/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

    High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound


    Product Summary:


    TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength.

    TIETM380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.


    Spec-of-TIE380-25.pdf

    High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound


    Feature


    > Outstanding thermal performance 2.5W/mK
    > High tack surface reduces contact resistance
    > RoHS compliant
    > UL recognized
    > Fiberglass reinforced for puncture, shear and tear resistance
    > Easy release construction


    Applications


    > Waterproof LED Power
    > SMD LED module
    > LED Flesible strip, LED bar
    > LED Panel Light
    > LED floor light
    > Routers


    Typical Properties of TIETM380-25

    Chemical typeEpoxyTest Method
    Appearance uncuredGray PasteVisual
    Appearance curedDull Gray SolidVisual
    ComponentsOne Component*****
    Heat Capacity0.7 l/g-KASTM C351
    Key SubstratesMetals, ceramics*****
    Hardness92 Shore AASTM 2240
    Continuous Use Temp-40 to 180℃*****
    Tensile strength Al/Al @25°C>2800psi*****
    Thermal Conductivity2.5 W/m-KASTM D5470
    Packing details

    1kg/can

    *****

    Application Features:TIE™380-25


    Color Gray

    Viscosity@25℃ 140,000 cPs

    Specific Gravity@25℃ 2.1 g/cc

    Shelf life @25℃° 10 Days

    @0℃° 6 Months

    (Storage methods and temperature will affect the shelf life)


    Curing procedures:

    Curing temperature Curing time

    100℃° 3 Hours

    125℃ 1.5 Hour

    150℃ 20 Minutes

    170℃ 5 Minutes


    Company profile


    Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    Quality High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound for sale
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