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One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A

Dongguan Ziitek Electronical Material and Technology Ltd.
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    Buy cheap One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A from wholesalers
     
    Buy cheap One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A from wholesalers
    • Buy cheap One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A from wholesalers
    • Buy cheap One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A from wholesalers

    One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIS580-12
    Certification : RoHS
    Price : 1-100USD/KG
    Payment Terms : T/T
    Supply Ability : 10000kg/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A

    One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive​


    Company Profile


    With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


    TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.


    TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.

    TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.


    TIS580-12 Series Datasheet-(E)-REV01.pdf



    Feature


    > Good thermal conductivity: 1.2W/mK

    > Good maneuverability and good adhesion

    > Low shrinkage

    > Low viscosity, leads to void-free surface

    > Good solvent resistance, water resistance

    > Longer working life

    > Excellent thermal shock resistance


    Application


    It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-12, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
    E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers

    Typical values of TISTM580-12

    AppearanceWhite pasteTest Method
    Density(g/cm3,25℃)1.2ASTM D297
    Tack-free time(min,25℃)≤20*****
    Cure type(1-component)Dealcoholized*****
    Viscosity@25℃ Brookfield (Uncured)5000 cpsASTM D1084
    Total cure time(d, 25℃)3-7*****
    Elongation(%)≥150ASTM D412
    Hardness(Shore A)25ASTM D2240
    Lap Shear Strength(MPa)≥2.0ASTM D1876
    Peel Strength(N/mm)>3.5ASTM D1876
    Operation temperature(℃)-60~250*****
    Volume Resistivity(Ω·cm)2.0×1016ASTM D257
    Dielectric Strength(KV/mm)21ASTM D149
    Dielectric Constant (1.2MHz)2.9ASTM D150
    Thermal Conductivity W/(m·K)1.2ASTM D5470
    Flame RetardancyUL94 V-0E331100

    Package:
    300ml/tube

    Our services


    Online-service : 12 hours , Inquiry reply within fastest.


    Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

    Well-trained & experienced staff are to answer all your inquiries in English of course.

    Standard Export Carton Or Marked With Customer's Information Or Customized.

    Provide free samples


    After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

    we will help you to deal with it and give you satisfactory solution.


    Quality One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A for sale
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