TIS300 Conductiver Silicone Material
TIS300 series has high shielding efficiency and is designedto
replace the more expensive silver . Nickelgraphite additivenot only
provides good electrical conductivity, but also theability to
absorb radio waves.TIS300 series is the most idealfor aluminum
casting or metal coated substrate.TIS300 seriesis made of materials
that resist the corrosion caused by currentelectricity and maintals
its stability in harsh environments.
Features
>Good thermal conductivity: 2.0 W/mK
>Low volume impedance value (Ohm):<1
>High compressibility, soft and elastic, suitable In low
pressure applications
>Available in a variety thickness
Applications
>3C product noise suppression
>Absorption of RAM high order harmonic
>Wifi signal improved
>The error rate of mobile phone and other signal mode conversion
>FPC IC and other components of the electronic devices, such as
laptops. tablet PCS , and other components of the electromagnetic
noise suppression.
| Typical Properties TIFTM300 Series |
| Color | Gray | Visual |
| Construction & Composition | Graphite nickel-filled silicone rubber | ****** |
| Thickness | 0.020"~0.200 (0.50mm-5.0mm) | ASTM D751 |
| Product Tolerance | ±10% | ****** |
| Density | 2.5g/cc | ASTM D297 |
| Volume impedance value | 1 Ohm-cm | ******* |
| Hardness | 65±5 Shore 00 | ASTM D2240 |
| Thermal Conductivity | 2.0W/mk | ASTM D5470 |
| Tensile strength | 30 Psi | ASTM D412 |
| Tearing strength | 6 IB/in | ASTM D412 |
| Flame retardant Rating | 94 V0 | UL E331100 |
| Continuous Use | -40~150℃ | ****** |
Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Independent R&D team
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