Kheat SP-Silica Gel Heating Plate For Power Industry
KheatTM SP-Silica gel heating plate is a heating material
developedand produce independently by Ziitek company.The silica gel
platehas excellent weather and aging resistance.As a insulation
materialon heating plate, it can enhance the mechanical strength
and
effectively prevent surface craking, greatly extend the service
life ofthe products. The epoxy plate can be customized according
thedesign requirements.
Features
>Thickness of resistor: 0.03-0.1mmT, Thickness of silica gel
heating plate :0.5-2mmT
>silica gel heating plate can help good contacting between
heating elements andheated products with excellent physical
strength and soft properties.
>The product is made of two silica gel heating sheet and
resistor laminated by high temperature, so it can be made to
various shape, holes can be reserved also foreasier installation
>Can be customized according to shape, size,power and voltage
>Silica gel heating plate has good chemical corrosion resistance
and can be usedin humid, corrosive gases and other terrible
enviroments
>Can be easily integrated with thin insulation materials,
provide light weight electric heating elements with insulation
layer.
>Can do adhesive on one side for convenient installation
>RoHS,CE,UL compliant
Applications
>New energy industry(battery)
>Communication security industry
>Video camera, hard disk video recorder
>Power industry, military aerospace
>All kinds of electronic products need to be heated
>Medical equipment, precision instrumentsand equipment
| Physical and electrical properties of Kheat SP silica gel heating
plate |
| Operating Voltage | 1~380V AC/DC |
| Diclectric Breakdown Voltage | ≥2500VAC/MIN |
| Insulation Resistance | ≥ 100MΩ |
| Recommended Power Density | 0.1~0.6W/c㎡ |
| Max Power Density | 2.0W/c㎡ |
| Service life | 8~15years |
| Continuous Use Temp | 200℃(it depends on temperature stability of the adhesive if
customer needs adhesive.) |
| Continuous Use Temp | -50~200℃ |
| Thickness | 1.1~2.0mmT(2.0~5mm customizable) |
| Mechanical Compression strength | 100KG/c㎡ |
| Pull Force of Guide Line | ≥80N |
| Pull Force of Soldering Point | ≥20N |
Company profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just
contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
